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PARA MÁS INFORMACIÓN CONTACTE CON:
Patentes de EE.UU. 4638672, 4812049, 5363699, 4944190 y 5,814,738; Patente canadiense 1325113; Patente
europea 0277121; Patente japonesa 1,858,116; Wafer-Cone: Patentes de Hong Kong HK1027622 & HK1066054;
Otras pat. pend. en EE.UU. y el extranjero
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