THERMAL PROTECTOR
For safety, power is automatically shut off
should the unit exceed a certain temperature.
Once the temperature has dropped to a safety
level, power is automatically turned on. Turn
off the switch and cool the iron.
After that, to continue operation,reduce the
temperature setting or increase the air flow.
Should the thermal Protector be tripped and
you do not wish to continue the operation or if
you leave that place, be sure to turn the Power
Switch off.
IMPORTANT: Disconnect the plug when you
don't use the unit for a long time. When
the power cord is connected into the power
supply,the unit has a little flow of electric-
ity, even the Power Switch is in off position.
So then you don't use the unit for a long
time,disconnect the plug.
FEATURES
KNOW YOUR TOOL
Before attempting to use this product, become
familiar with all of its operating features and
safety requirements.
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2
3
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1. Power Switch for heat gun.
2. Heat gun holder.
3. Air regulator knob.
4. Heat gun.
5. Temperature regulator knob for heat gun.
6. Power switch for soldering iron.
7. Soldering iron connection port.
8. Iron holder.
9. Soldering iron heat regulator knob.
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OPERATION INSTRUCTIONS
FUNCTION
• Prevent static electric and creepage to dam-
age the PCB.
• Unnecessary touch the PCB,so can avoid mov-
ing element and heating impaction.
• Extensively adjust air and temperature and
select different nozzle,so it can fit most of
SMD.
• Use inlet heating element,the type of heat-
ing element and nozzle is same as the inter-
national.
• Delay to blow air when turn the power switch
off, it can protect the automatic.
USES
Fits most of SMD. Such as SOIC, CHIP, QFP, PLCC,
BGA etc.
QFP DESOLDERING
• Plug the power cord into the power sup-
ply. After connection,the automatic blowing
function with start sending air through the
pipe,but the Heating Element remains cool.
• Turn The Power Switch on. The power switch
may be turned on at any time while the au-
5
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tomatic blowing function is operating. Once
the power Switch is turned on,the Heating Ele-
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ment will begin to warm up.
• Adjust the Air Flow and Temperature Con-
trol Knobs. After adjusting the Air Flow and
Temperature Control knob, wait for the tem-
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perature to stabilize for a short period of time.
Refer to the distribution chart. For your refer-
8
ence, we recommend you to adjust the tem-
perature around 300 to 350˚ C. As for Airflow
in case of single nozzle, set the knob 1-5, in
another nozzle, set it from 4- 8. When using
a single nozzle, set the temperature control
knob to higher than 6.
• Place the FP Pick-up under le lead. Slip the FP
Pick-up Wire under the IC lead. If the width of
the IC does not match the size of the FP Pick-
up, adjust the width of the wire by suppressing
the wire.
• Melt the solder. Hold the iron so that the
Nozzle is located directly over,but not touch-
ing the IC, and allow the hot air to melt solder.
Be careful not to touch the leads of the IC with
the Nozzle.