C.I.F GR 2030 Manual De Servicio página 3

GR 2030 / GR 2434 : Codes DP36 / DP37
ENGLISH
CONSTRUCTION OF ETCHING MACHINES
Entirely made of welded PVC (not bonded). Transparent tank, 100% visibility, SOLID – STABLE – CLEAN AND
ROBUST.
Motors with sealed membrane placed under the machine base and protected by a cap.
Pump and heater unique control to accelerate liquid circulation during first heating and to avoid forgetting the heater
between two handlings.
Heating : pyrex coated immersion heaters under pyrex with thermostat and built-in indicators. Can be adjusted on the
external part of the resistor.
BEFORE USE :
•
Remove packaging protecting the tank and the resistor.
•
Control that plastic tubes are correctly fit on nozzles.
•
Fill your machine with superactivated perchloride (only up to filling level)
•
Immersion heater setting : Required temperature is not reached until the indicator built-in in the resistor is on.
Clamp under the thumb and the index finger the rubber nipple which comes out from the head and turn the
adjustment rod to obtain an optimal etching temperature : 30°.
IMPORTANT : Bath temperature must be controlled on digital thermometers stuck to the tanks. MAXIMUM
TEMPERATURE : 30°
INSTRUCTIONS FOR USE
•
Once the machine is filled with etching agent, wait for the temperature torise
•
Clip your printed circuit single or doubled-sided on the pliers
•
Plunge pliers + circuit into etching tank
•
You can control etching progress
For a quick etching, only use C.I.F. superactivated perchloride. Do not use ordinary perchloride. C.I.F. perchloride is
self-cleaning and has a constant etching curve. Ammonium persulfate is clean and transparent, etching power is
inferior to superactivated perchloride.
EXPOSURE
•
Remove adhesive protection from your C.I.F. light sensitive plate.
•
Place your film or original drawing on the photo layer (Pay special attention to placement ; component side or
track side).
•
Place the set (film + board) on your exposure unit.
•
Expose your board :
from 2' to 2'3'' when using a film or an inactinic grid
from 2'30'' to 4' when using a plant tracing paper
DEVELOPMENT
Pour special developer into vertical tray. Ordinary developer makes foam which could make your tray overflow
Immediately after exposure, put the board into the developer and shake the circuit with multi-circuit pliers..
Photosensitive resin which has been exposed should disappear in less than 2 minutes. If development has not been
totally carried out, please refer to the table at the end of the notice).
If the plate is not immediately etched, rinse it with running water.
ETCHING
To avoid a waste of time, heat your etching machine before exposing your circuit.
Put pliers + circuit into the etching tank.
Etching agent will corrode the copper which is not protected by resin.
Etching time will be from 6 to 7 minutes if etching agent is new,
When etching time has doubled, change ferric chloride.
Rinse into vertical rinsing tray
RESIN REMOVAL
With C.I.F. eliminator without solvent or with a buffer impregnate with methylated spirits.
Resin can be left during drilling to protect copper.
Etched board can be reexposed and resin destroyed with U.V. : plunge the board into the developer.
Your circuit is finished
Version 12.01
This document is property of CIF, It may not be reproduced without his consent. - © Copyright 2000
ETCHING MACHINE GR 2030 / GR2434
DO NOT TURN ON HEATER WHEN THE MACHINE IS EMPTY
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