Equipotential Bonding - Weller WX 1 Traducción Del Manual Original

For your safety
Soldering and desoldering
Carry out soldering work as directed in the opera-
ting instructions of your connected soldering tool.
Handling the soldering tips
Coat the selective and tinnable soldering tip with
„
solder when heating it up for the first time. This
removes oxide coatings which have formed
during storage and impurities from the soldering
tip.
Make sure that the soldering tip is well coated
„
with solder during breaks between soldering work
and prior to storage of the device.
Do not use aggressive fluxing agents.
„
Always make sure that the soldering tips are
„
fitted properly.
Select as low a working temperature as possible.
„
Select the largest possible soldering tip shape for
„
the application.
Rule of thumb: the soldering tip should be roughly
as large as the soldering pad.
Coat the soldering tip well with solder to ensure
„
WX 2, WXD 2, WXA 2: Overload cut-out (255 W)
To avoid overloading a WX station, one channel
is automatically deactivated if the power output
of both tool channels is greater than 255 watt
(Auto-Off).

Equipotential bonding

a
b
c
d
32
that there is efficient heat transfer between the
soldering tip and the soldering area.
Prior to extended breaks between soldering work,
„
switch off the soldering system or use the Weller
function to reduce the temperature when the
soldering equipment is not in use.
Coat the tip with solder prior to storage if you do
„
not intend to use the soldering iron for an
extended period of time.
Apply solder directly to the soldering area, not to
„
the soldering tip.
Change the soldering tips using the designated
„
tool.
Do not apply mechanical force to the soldering
„
tip.
Notice
The control units have been adapted to hold a
medium-sized soldering tip. Discrepancies may
occur if the tip is changed or a different shaped
tip is used.
An overload cut-out will also occur if the following
combinations of tools are connected: e. g.
- 2 WXHP 120 heating plates
- A WXHP 120 heating plate and desoldering iron
WXDP 120 or WXDV 120
Four variants are possible by connecting the 3.5 mm jack socket
differently:
a Hard-grounded
b Equipotential
bonding
c Floating
d Soft-grounded
supplied without plug.
with plug, equaliser at centre contact.
with plug
with plug and soldered resistor. Ground-
ed through selected resistor.