DeguDent Deguvest L Instrucciones Para El Uso página 7

Tabla de contenido

Publicidad

Idiomas disponibles
  • MX

Idiomas disponibles

3
Instructions for use
3.1
Roughen and clean the surfaces of the object to be soldered . The soldering gap should be parallel
and should be ≤ 0 .2 mm .
3.2
Pay attention to correct position of the object on the model . Close the soldering gap with dental wax
or modelling wax . Then fix the object with adhesive wax and/or with acrylic which burns without residue .
Objects fused with dental porcelain must have no contact with the solder investment compound .
Cover porcelain, especially towards the cervical margin and to the basal surface with wax .
After the wax has been boiled out, a space is left between the solder investment compound and
the porcelain in this way .
3.3
Fill Deguvest L and water (distilled water) in the recommended mixing ratio into a clean mixing
bowl and thoroughly mix or knead with clean spatula .
3.4
Form the solder investment compound into bars and place the object to be soldered with slight
hand vibration carefully into the investment compound .
Keep the soldering gap free of investment to avoid sulfur damage with sensitive alloys .
3.5
Cut back the soldering block . Remove the adhesive wax or acrylic and boil out the soldering gap .
Pay attention when boiling out that no adhesive wax is swept into the soldering gap .
Do not remove the wax with a steam cleaning unit .
3.6
Place fluxing agent in the solder gap and on any adjoining metal surface . When soldering
a ceramically veneered workpiece, use a suitable fluxing agent (such as DS1 flux) .
3.7
Pre-dry the block of solder in the pre-heating oven and pre-heat (up to 400 °C) .
3.8
Flame soldering
Make sure to avoid local overheating in flame soldering .
3.9
When selecting the solder, please note the difference between the soldering temperature and
the alloy's solidus temperature .
3.10
When soldering after ceramic firing, always talk the firing temperature of the ceramic material
and the coefficient of thermal expansion of the alloy into due account .
3.11
Allow the solder block to cool until it is lukewarm, then divest the workpiece and pickle for
approx .10 minutes .
GA_Deguvest L_50571802f_0315.indd 7
7
12.03.15 14:27

Publicidad

Tabla de contenido
loading

Tabla de contenido