JBS Advanced Serie Manual Del Usuario página 8

ENGLISH
DESOLDERING PROCEDURE
We would also recommend the use of the nozzles
of larger diameter, reserving the smallest one
(diam. 4 mm) for desoldering small components
such as resistors, condensers and the like, bearing
in mind that with this small nozzle the concentration
of heat is greater and care must be taken to avoid
burning the printed circuit; we recommend keeping
below a temperature of 350 °C (662 °F) and air flow
of 6.
Depending on the size of the integrated circuit to
be desoldered, you will have to use:
A) Protector + tripod
B) Extractor
C) Tripod
A) Protector + tripod:
- Select protector and tripod size in function of
the IC to be desoldered and place it over the
component.
- Use the SUCTION button to start the pump
and then place the tripod. Press the suction
cup until it sticks onto the component.
- Use the pedal or the HEAT button to start the
self-contained hot-air pump, directing it with
a circular movement at the component
terminals and taking care to distribute the
heat evenly.
- When the soldering flux turns liquid the
extractor will automatically lift the component.
B) Extractor:
- Select extractor size in function of the IC to
be desoldered. Use the SUCTION button to
start the pump.
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