ASROCK H470M Pro4 Manual Del Usuario página 8

1.2 Specifications
Platform
CPU
Chipset
Memory
Expansion
Slot
Graphics
6
• Micro ATX Form Factor
• Solid Capacitor design
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• Supports 10 Gen Intel® Core
• Digi Power design
• 9 Power Phase design
• Supports Intel® Turbo Boost 3.0 Technology
• Intel® H470
• Dual Channel DDR4 Memory Technology
• 4 x DDR4 DIMM Slots
• Supports DDR4 2933/2800/2666/2400/2133 non-ECC, un-
buffered memory
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
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* Core (i9/i7) support DDR4 up to 2933; Core
Pentium® and Celeron® support DDR4 up to 2666.
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 128GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 15μ Gold Contact in DIMM Slots
• 2 x PCI Express 3.0 x16 Slots (PCIE1/PCIE4: single at x16
(PCIE1); dual at x16 (PCIE1) / x4 (PCIE4))
* Supports NVMe SSD as boot disks
• 2 x PCI Express 3.0 x1 Slots
• Supports AMD Quad CrossFireX
• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
and Intel® CNVi (Integrated WiFi/BT)
• Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
• Hardware Accelerated Codecs: AVC/H.264, HEVC/H.265
8bit, HEVC/H.265 10bit, VP8, VP9 8bit, VP9 10bit, MPEG 2,
MJPEG, VC-1
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Processors (Socket 1200)
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(i5/i3),
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and CrossFireX