Disassembly And Disposal; Maintenance - SICK GRSE18V Instrucciones De Operación

8

DISASSEMBLY AND DISPOSAL

8 Disassembly and disposal
9

Maintenance

12
LED indicator/fault pattern
Green LED lights up, no output
signal when object is detected
Yellow LED flashes
Yellow LED lights up, no object
in the path of the beam
The sensor must be disposed of according to the applicable country-specific regula‐
tions. Efforts should be made during the disposal process to recycle the constituent
materials (particularly precious metals).
NOTE
Disposal of batteries, electric and electronic devices
• According to international directives, batteries, accumulators and electrical or
electronic devices must not be disposed of in general waste.
• The owner is obliged by law to return this devices at the end of their life to the
respective public collection points.
•
WEEE: This symbol on the product, its package or in this document, indi‐
cates that a product is subject to these regulations.
SICK sensors are maintenance-free.
We recommend doing the following regularly:
Clean the external lens surfaces
•
Check the screw connections and plug-in connections
•
No modifications may be made to devices.
Subject to change without notice. Specified product properties and technical data are
not written guarantees.
Cause
Test input (Test) is not con‐
nected properly
Sensor is still ready for opera‐
tion, but the operating condi‐
tions are not ideal
The beam of light of a photo‐
electric through-beam sensor
hits the receiver of another
(neighboring) photoelectric
through-beam sensor
Measures
See the note on connecting
the TI
Check the operating condi‐
tions: Fully align the beam of
light (light spot) with the
receiver / Clean the optical
surfaces / Readjust the sensi‐
tivity (potentiometer) / If the
potentiometer is set to the
max. sensitivity: Reduce the
distance between the sender
and the receiver/ Check sens‐
ing range and adjust if neces‐
sary, see table 6.
Swap the sender and receiver
arrangement at every sec‐
ond through-beam photoelec‐
tric sensor and ensure that
there is sufficient distance
between the through-beam
photoelectric sensors, see
figure 10.
8021182.16B5 | SICK
Subject to change without notice