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1.2 Specifications
Platform
- Micro ATX Form Factor: 8.9-in x 7.2-in, 22.6 cm x 18.3 cm
- All Solid Capacitor design
CPU
- Supports 3
LGA1155 Package
- 3 + 1 Power Phase Design
- Supports Intel
- Supports Hyper-Threading Technology (see CAUTION 1)
Chipset
- Intel
- Supports Intel
- Supports Intel
Technology
Memory
- Dual Channel DDR3 Memory Technology (see CAUTION 3)
- 2 x DDR3 DIMM slots
- Supports DDR3 1600/1333/1066 non-ECC, un-buffered
memory (DDR3 1600 with Intel
1333 with Intel
- Max. capacity of system memory: 16GB (see CAUTION 4)
- Supports Intel
Expansion Slot
- 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode)
(see CAUTION 5)
* PCIE 3.0 is only supported with Intel
Intel
- 1 x PCI Express 2.0 x1 slot
Graphics
* Intel
be supported only with processors which are GPU
integrated.
- Supports Intel
Sync Video 2.0, Intel
Technology, Intel
- Pixel Shader 5.0, DirectX 11 with Intel
Pixel Shader 4.1, DirectX 10.1 with Intel
- Max. shared memory 1760MB (see CAUTION 6)
- Dual VGA Output: support DVI and D-Sub ports by
independent display controllers
- Supports DVI with max. resolution up to 1920x1200 @ 60Hz
- Supports D-Sub with max. resolution up to 2048x1536 @
75Hz
- Supports HDCP function with DVI port
ASRock B75M-DGS Motherboard
rd
nd
and 2
Generation Intel
®
Turbo Boost 2.0 Technology
®
B75
®
Small Business Advantage (see CAUTION 2)
®
Rapid Start Technology and Smart Connect
®
®
Sandy Bridge CPU)
®
Extreme Memory Profi le (XMP)1.3/1.2
®
Sandy Bridge CPU, it only supports PCIE 2.0.
®
HD Graphics Built-in Visuals and the VGA outputs can
®
HD Graphics Built-in Visuals: Intel
®
TM
InTru
3D, Intel
®
TM
Insider
, Intel
®
TM
Core
i7 / i5 / i3 in
Ivy Bridge CPU, DDR3
®
Ivy Bridge CPU. With
®
Quick
®
Clear Video HD
®
HD Graphics 2500/4000
®
Ivy Bridge CPU.
®
Sandy Bridge CPU
5
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