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RIDGID R40401 Manual Del Operador página 19

Sierra para losas y pavimento de 203 mm (8 pulg.) con láser

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Idiomas disponibles

Idiomas disponibles

OPERATION
MAKING CUTS
Always draw the line to be cut on the tile using a marker or
grease pencil. If the tile is shiny and hard-to-mark, place
masking tape on the tile and mark the tape.
A common problem when cutting tile is straying from the
marked line. Once you've strayed from the mark, you can not
force the wheel back to the line by twisting the tile. Instead,
back up and recut the tile slicing off a small amount of tile
until the wheel is back on track.
To avoid this problem, use the miter guide whenever
possible.
Another problem is cutting difficult material. To prevent
chipping of the material at the end of the cut, use a plunge
cut.
NOTE: A more shallow blade adjustment may help minimize
chipping, see the Depth stop adjustments section.
Clean the saw table and miter guide frequently during use.
Debris from the cut material can interfere with tool function.
DANGER:
Laser radiation. Avoid direct eye contact with light
source.
WARNING:
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
USING THE LASER GUIDE
See Figure 21.
Using a straight edge or square, draw a mark on the tile
with a marker or grease pencil. Turn the laser on and off by
pressing the laser guide switch located on the side of the
"D" handle. When the laser is turned on it will generate a red
line on the work surface. This line will let you see your mark
and the laser guide line at the same time, and will assist you
in lining up the mark for more accurate cutting of the tile.
NOTE: Laser may be difficult to see in bright sunlight.
With the wheel in the cutting position, move the tile until the
mark and the laser line are aligned.
Make several practice cuts on different styles and thickness
of material. Repeat the steps as necessary.
Removing Your Mark:
Position the tile so that the laser line is near the left edge of
your mark in order to remove the mark.
To Cut Your Mark:
Position the tile so that the laser line is near or over your
mark in order to cut the mark.
To Leave Your Mark:
Position the tile so that the laser line is near the right edge
of your mark in order to leave the mark.
After you have become familiar with using the laser guide,
you will be able to remove, cut, or leave your mark on the
work surface. Practice will teach you the correct position for
aligning your mark with the laser line.
To adjust the position of the laser guide line, refer to the
Adjustments section later in this manual.
19 — English
LASER SWITCH
MARK
Fig. 21

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Este manual también es adecuado para:

R4040