Tabla de contenido
Publicidad
Idiomas disponibles
Idiomas disponibles
Electrostatic discharge
............................................................................................................................................................................................................................................................
Introduction
The barred-hand symbol
ESD instructions
...............................................................................................................................................................................................................................................................
1 - 1 8
Electrostatic discharge (ESD), caused by touching with the hand for
example, can destroy semiconductor components. The correct operation
of the complete system is then no longer assured.
Industry experience has shown that all semiconductor components can
be damaged by static electricity that builds up on work surfaces and
personnel. The electrostatic discharge can also affect the components
indirectly via contacts or conductor tracks. The electrostatic charges are
produced by various charging effects of movement and contact with
other objects. Dry air allows greater static charges to accumulate. Higher
potentials are measured in areas with low relative humidity, but
potentials high enough to cause damage can occur anywhere.
Circuit packs containing components that are especially sensitive to
electrostatic discharge are identified by warning labels bearing the
barred-hand symbol.
Observe the following ESD instructions to avoid damage to
electrostatic-sensitive components:
•
Wear working garment made of 100% cotton to avoid electrostatic
charging.
•
Touch the circuit packs at the edges or the insertion and removal
facilities only.
•
Ensure that the rack is grounded.
•
Wear conductively connected wrist straps and connect them to the
rack ESP bonding point.
•
Work in an area which is protected against electrostatic discharge.
Use conducting floor and bench mats which are conductively
connected to the rack ESP bonding point.
•
Conductively connect all test equipment and trolleys to the rack
ESP bonding point.
•
Store and ship circuit packs and components in their shipping
packing. Circuit packs and components must be packed and
unpacked only at workplaces suitably protected against build-up of
charge.
•
Whenever possible, maintain the relative humidity of air above
20%.
EN: Safety guide
365-374-138A4
Issue 1, November 2003
Publicidad
Capítulos
Tabla de contenido
