Publicidad
1.2 Specifications
Platform
OC Formula Kit
CPU
Chipset
Memory
Expansion Slot
6
-
CEB Form Factor: 12.0-in x 10.5-in, 30.5 cm x 26.7 cm
- Premium Gold Capacitor design (100% Japan-made
high-quality Conductive Polymer Capacitors)
OC Formula Power Kit
- Digi Power
- Dual-Stack MOSFET (DSM) (see CAUTION 1)
- Multiple Filter Cap (MFC) (Filter different noise by 3 different
capacitors: DIP solid cap, POSCAP and MLCC)
- Premium Alloy Choke (Reduce 70% core loss compare to
iron powder choke)
OC Formula Connector Kit
- Hi-Density Power Connector
- 15μGold Finger (CPU and memory sockets)
OC Formula Cooling Kit
- Twin-Power Cooling (Combine active air cooling and water
cooling)
- 8 Layer PCB
- 4 x 2oz copper
- GELID GC-Extreme Thermal Compound
rd
nd
- Supports 3
and 2
LGA1155 Package
- 12 + 4 Power Phase Design
®
- Supports Intel
Turbo Boost 2.0 Technology
®
- Supports Intel
K-Series unlocked CPU
- Supports Hyper-Threading Technology (see CAUTION 2)
®
- Intel
Z77
®
- Supports Intel
Rapid Start Technology and Smart Connect
Technology
- Dual Channel DDR3 Memory Technology (see CAUTION 3)
- 4 x DDR3 DIMM slots
- Supports DDR3 3000+(OC)/2800(OC)/2666(OC)/2400(OC)/
2133(OC)/1866(OC)/1600/1333/1066 non-ECC, un-buffered
memory
- Max. capacity of system memory: 32GB (see CAUTION 4)
®
- Supports Intel
Extreme Memory Profile (XMP)1.3/1.2
- 2 x PCI Express 3.0 x16 slots (PCIE2/PCIE4: single at x16
(PCIE2) / x8 (PCIE4) or dual at x8/x8 mode)
(see CAUTION 5)
* PCIE 3.0 is only supported with Intel
ASRock Z77 OC Formula Motherboard
®
Generation Intel
Core
®
Ivy Bridge CPU. With
TM
i7 / i5 / i3 in
Publicidad
