9 HARDWARE SPECIFICATION
Content
Programming Language
Environment
Operating Temperature
Storage Temperature
Maximum humidity
Gas presence
Main
Maximum vibration
structure
Impact resistance
Maximum
ESD
noise
EFT
CS
SR
EMI
Installation
Enclosure type
Assembly Mode
Assembly Position
Wiring
Dimensions
9.1 MODEL FEATURES
Power Supply
AC
100~
240V
◎
10HR-A
10
points
12HR-D
12HT-D
◎
20HR-A
20HR-D
20HT-D
20
points
20HR-12D
20VR-D
20VT-D
-20° to 55°C (-4° to 131°F)
-40° to 70°C (-40° to 158°F)
90% (Relative, non-condensable)
Non-corrosive gases
Amplitude 0,075mm, acceleration 1,0g, in
compliance with IEC60068-2-6
Peak value 15g,11ms, in compliance with
IEC60068-2-27
Contact ±4KV, air discharge ±8KV
AC Power: ±2KV DC: ±1KV
0,15~80 MHz 10V/m
80~1000 MHz 10V/m
EN55011 B class
IP20
Direct Assembly or DIN-rail Assembly (35 mm)
In compliance with chapter 4 - Installation
AWG 14 / 2,6 mm
2x90x59,6 mm(WxLxH) DIN-rail
72x126x59,6 mm(WxLxH) Direct Installation
24
12
VDC
VDC
Standard Models
6
4
8*
4
◎
◎
8*
4
transistor
Standard Models
12
8
◎
12*
8
◎
12*
8
transistor
◎
12*
8
Models with Communication Port
◎
12*
8
◎
12*
8
transistor
- English -
Specification:
Ladder & FBD
2
◎ ◎ ◎
relay
◎ ◎ ◎
2
relay
◎ ◎ ◎
2
◎ ◎ ◎
relay
◎ ◎ ◎
relay
4
◎ ◎ ◎
4
◎ ◎ ◎
relay
4
◎ ◎ ◎
relay
4
◎ ◎ ◎
4
Hardware Specification
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎
◎ ◎
CLIC-02 | 139